Enermax on Thursday introduced its new family of closed-loop liquid coolers designed specifically for AMD’s new Ryzen Threadripper CPUs. The new custom-made LiqTech TR4 AIO LCS feature waterblocks cover 100% of the CPU IHS (integrated heat spreader), a notable improvement over preexisting designs, which designed for smaller chips only partly cover TR4 chips.

High-end air and liquid coolers these days can dissipate huge amounts of heat that exceed TDP of even the most powerful CPUs, such as AMD’s Threadripper or Intel’s Core i7/i9. Manufacturers of coolers are eager to equip their devices with mounting brackets to make them compatible with the new 4094-pin TR4 and 2066-pin R4 sockets as well as the new microprocessors. However, since the coolers were not designed for the large TR4 IHS from the ground up, they cannot cover 100% of its surface. And even though many of them can enable reliable operation at stock frequencies and TDP, they may not be efficient enough during overclocking. Enermax equipped its LiqTech TR4 coolers with special waterblocks that cover 100% of the TR4 IHS to maximize thermal performance and overclocking potential of the new CPUs.

Waterblocks of the Enermax LiqTech TR4 240 and LiqTech TR4 360 AIO liquid coolers come with cold plates featuring the company’s micro-channel-based design with a shunt channel (the firm calls it SCT) that maximizes cooling performance. Both coolers use the same 3000 RPM pump with flow rate of 450 L/h and, as their names imply, are equipped with a 240 or a 360 mm radiator. Enermax claims that the LiqTech TR4 240 and 360 closed-loop LCS can dissipate over 500 W of heat, thus providing a lot of headroom for overclocking.

Specifications of Enermax LiqTech TR4-Series Cooling Systems
  LiqTech TR4 240
LiqTech TR4 360
Dimensions Waterblock
Length 76 mm
Width 82.1 mm
Height 38.7 mm
Radiator Length 274 mm 394 mm
Width 120 mm
Depth 39 mm 28 mm
Fan Length 120 mm × 2 120 mm × 3
Width 120 mm × 2 120 mm × 3
Depth 26 mm
Fan (single) Speed (RPM) 500-2300
Airflow (CFM) 23.81 ~ 102.17 CFM
Static Pressure (mm-H2O) 0.673 ~ 6.28 mm-H2O
Noise (dBA) 14 ~ 28
Power 3.6 W
MTBF (hrs) ≧160,000 @ unknown oC
Connector 4-pin PWM connector
Pump Speed (RPM) 3000
Life Expectancy ≧100,000 @ unknown oC
Power 4.8 W
Tubing Length 310 ~ 315 mm
Compatibility AMD TR4/SP3
Intel -
TDP ≧500 W

The oversized waterblocks of the LiqTech TR4 240 and 360 AIO LCS do not allow installation of the coolers on other sockets, which is a price of a custom-made design. As for reliability, just like other products of the kind they are rated for 100 thousand hours MTBF (pump) and come with a two-year warranty.

The Enermax LiqTech TR4 240 and 360 closed-loop LCS will be available in the U.S. in late August for $129.99 and $149.99, respectively. Pricing and availability in other countries may vary.

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Source: Enermax

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  • nathanddrews - Thursday, August 10, 2017 - link

    THAT is rad. ;-)
  • DanNeely - Thursday, August 10, 2017 - link

    Is it going to be possible to make new universal blocks that are big enough to fully cover giant chips like threadripper and still fit on boards designed for smaller mainstream chips?
  • mapesdhs - Thursday, August 10, 2017 - link

    DanNeely, probably not, but check out various reviews that have been published on youtube demonstrating different paste application methods for TR using existing products.
  • HomeworldFound - Thursday, August 10, 2017 - link

    Perhaps it'll depend on how big Intel's new chips are?
  • WatcherCK - Thursday, August 10, 2017 - link

    A good price for something that will dissipate 500W+ and Epyc compatibility as well... I hope the board and CPU prices come down a bit more as demand boosts production...
  • loguerto - Friday, August 11, 2017 - link

    I love Enermax products, their PSU's are nothing less than amazing.
  • Comdrpopnfresh - Saturday, August 12, 2017 - link

    Do existing waterblocks that can be made bracket-compatible cover the silicon directly under the IHS? Maybe I am missing something, but doesn't 'the shortest distance between two points' also apply to heat dissipation?
  • Dragonstongue - Sunday, August 13, 2017 - link

    that would mean with TR that there is basically an X type design in the LCS, probably not the best option, and if only 2 of those dies are actually pushing heat, that means there would more or less have to be specific plate for specific chip being used, seems best off to just cover 100% of the IHS ^.^
  • MrSpadge - Monday, August 14, 2017 - link

    Yep, the further you move away from the hot chips, the less important the thermal contact becomes for the overall heat transfer.
  • hasta666 - Friday, August 18, 2017 - link

    What's lacking with TR? Cooling solution at launch. I'm not talking about adapters. They could have at least worked with one company to bring one decent solution for early birds. I bought one 1920x but I got to wait for a proper solution.

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