Semiconductors

Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA) multi-bridge-channel field-effect transistors (MBCFETs). "Optimizing Cortex-X and Cortex-A processors on the latest Samsung process node underscores our shared vision to redefine what’s possible in mobile computing, and we look forward to continuing to push boundaries to meet the relentless performance and efficiency demands of the AI era," said Chris Bergey, SVP and GM, Client Business at Arm. Under the program, the companies aim to deliver tailored versions of Cortex-A and Cortex-X cores made on Samsung's 2 nm-class process technology for various applications, including smartphones, datacenters, infrastructure, and various customized system-on-chips. For now, the companies does not...

IFS Reborn as Intel Foundry: Expanded Foundry Business Adds 14A Process To Roadmap

5 nodes in 4 years. This is what Intel CEO Pat Gelsinger promised Intel’s customers, investors, and the world at large back in 2021, when he laid out Intel’s...

26 by Ryan Smith 5 days ago

GlobalFoundries to Receive $1.5 Billion In Funding from U.S. CHIPS Act

The United States Department of Commerce and GlobalFoundires announced on Monday that the US will be awarding GlobalFoundries with $1.5 billion in funding under the CHIPS and Science Act...

5 by Anton Shilov 6 days ago

GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected

When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to...

25 by Anton Shilov on 2/14/2024

ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...

8 by Anton Shilov on 2/14/2024

Global Semiconductor Sales Hit $526.8 Billion in 2023

The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a...

13 by Anton Shilov on 2/9/2024

TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan

Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...

4 by Anton Shilov on 2/6/2024

Intel Teams Up with UMC for 12nm Fab Node at IFS

Intel and UMC on Thursday said they had entered into an agreement to jointly to develop a 12 nm photolithography process for high-growth markets such as mobile, communication infrastructure...

12 by Anton Shilov on 1/25/2024

Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations

Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9...

2 by Anton Shilov on 1/25/2024

TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval

When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and...

36 by Anton Shilov on 1/19/2024

TSMC Posts Q4'23 Earnings: 3nm Revenue Share Jumps to 15%, 5nm Overtakes 7nm For 2023

Taiwan Semiconductor Manufacturing Co. released its Q4'2023 and full year 2023 financial results this week. And along with a look at the financial state of the firm as it...

2 by Anton Shilov on 1/19/2024

Synopsys to Acquire Ansys: Set to Offer EDA, Analysis, and Simulation Tools

Synopsys on Tuesday announced that it had reached a definitive agreement to acquire Ansys in a deal valued at $35 billion. Synopsys specializes primarily on electronic design automation (EDA...

0 by Anton Shilov on 1/16/2024

ASML's First High-NA EUV Litho Scanner Arrives At Intel [UPDATED]

Update 1/5/2024: Intel Oregon announced on Thursday that it has received its shipment of ASML's first-generation Twinscan EXE:5000 High-NA EUV lithography scanner. The two companies will start assembly process...

28 by Anton Shilov on 1/5/2024

Intel Reiterates: We Are Not Going to Spin Off IFS

When Intel struggled with its 10nm process technology a few years ago, some investors suggested that the company would be better-off spinning its chip production into an independent foundry...

42 by Anton Shilov on 12/15/2023

TSMC Solidifies Leadership on Foundry Market as Intel Jumps into Top 10

The global foundry industry witnessed a substantial rise in demand in the third quarter of 2023, according to TrendForce. The Top 10 foundries collectively saw their revenue soar to...

7 by Anton Shilov on 12/6/2023

Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple

Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S...

12 by Anton Shilov on 12/4/2023

Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024

Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...

9 by Anton Shilov on 11/2/2023

TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue

Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...

7 by Anton Shilov on 10/19/2023

Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners

Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...

14 by Anton Shilov on 10/17/2023

TSMC: We Want OSATs to Expand Their Advanced Packaging Capability

Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...

2 by Anton Shilov on 10/16/2023

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