NAND

As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first time the company’s forthcoming 238 layer TLC NAND, which promises both improved density/capacity and improved bandwidth. At 238 layers, SK hynix has, at least for the moment, secured bragging rights for the greatest number of layers in a TLC NAND die – though with mass production not set to begin until 2023, it’s going to be a while until the company’s newest NAND shows up in retail products. Following closely on the heels of Micron’s 232L TLC NAND announcement last week, SK hynix is upping the ante ever so slightly with a 238 layer design. Though...

Micron’s 232 Layer NAND Now Shipping: 1Tbit, 6-Plane Dies With 50% More I/O Bandwidth

Ahead of next week’s Flash Memory Summit, Micron this morning is announcing that their next-generation 232 layer NAND has begun shipping. The sixth generation of Micron’s 3D NAND technology...

18 by Ryan Smith on 7/26/2022

CES 2022: OWC Expands Atlas Series with CFexpress Offerings

OWC is introducing a number of CFexpress products as part of their 2022 CES announcements today. The new Atlas Pro and Atlas Pro Ultra CFexpress cards join the Atlas...

1 by Ganesh T S on 1/4/2022

Intel Sells SSD Business to SK hynix as new Subsidiary Solidigm

In a brief news release from Intel this afternoon, the chip firm has announced that it has closed on the first stage of its deal to sell its SSD...

21 by Ryan Smith on 12/29/2021

Startup Showcases 7 bits-per-cell Flash Storage with 10 Year Retention

One of the key drivers to increase capacity in next generation storage has been to increase the number of bits that can be stored per cell. The easy jump...

48 by Dr. Ian Cutress on 12/15/2021

Next Gen NVMe SD Card Review: The SM2708 Controller Serves it Hot and Fast

Flash-based removable media has a host of use cases in products ranging from content capture devices to portable game consoles. Behind the standards of these is the SD Association...

43 by Ganesh T S on 9/9/2021

Western Digital Reimagines HDD - Flash Integration with OptiNAND

The last few years have seen plenty of new innovations come up in the hard-disk drive market. For quite some time, the HDD technology roadmap was shared industry-wide -...

51 by Ganesh T S on 8/31/2021

Intel’s DPG Launch Event April 6th: Early Look at 3rd Gen Xeon Scalable (Ice Lake)

Today Intel has announced that it will be holding a launch event on April 6th for the new vision of its Data Platform Group. This event is set to...

33 by Dr. Ian Cutress on 3/19/2021

SK Hynix to Buy Intel’s NAND Memory Business For $9 Billion

In a joint press release issued early this morning, SK Hynix and Intel have announced that Intel will be selling the entirety of its NAND memory business to SK...

66 by Ryan Smith on 10/20/2020

Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future

One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...

23 by Dr. Ian Cutress on 12/30/2019

Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019

Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...

21 by Anton Shilov on 8/16/2019

Western Digital: Nearly All NAND Capacities Resumed Normal Operations

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...

31 by Anton Shilov on 8/1/2019

Toshiba Memory To Rebrand As Kioxia

In 2017, Toshiba was forced to sell off its flash memory business to stave off bankruptcy. The memory business was spun off as Toshiba Memory Corporation and sold for...

17 by Billy Tallis on 7/18/2019

Supply of DRAM, NAND & Displays Could Be Disrupted by Japan & South Korea Dispute

South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese...

39 by Anton Shilov on 7/5/2019

Toshiba & WD NAND Production Hit By Power Outage: 6 Exabytes Lost

Toshiba Memory and Western Digital on Friday disclosed that an unexpected power outage in the Yokkaichi province in Japan on June 15 affected the manufacturing facilities that are jointly...

150 by Anton Shilov on 6/28/2019

Toshiba Memory & Western Digital Finalize Fab K1 Investment Agreement

Toshiba Memory and Western Digital on Friday announced that they had finalized a formal agreement regarding a joint investment in the K1 manufacturing facility near Kitakami, Iwate Prefecture, Japan...

1 by Anton Shilov on 5/20/2019

Toshiba Begins to Sample UFS 3.0 Drives: 96L 3D TLC NAND, Up to 2.9 GB/s

Toshiba said late on Tuesday that it had started to sample its first UFS 3.0 storage solution. The device is aimed at mobile applications and promises to offer performance...

0 by Anton Shilov on 1/23/2019

Western Digital Demonstrates 4TB USB-C Thumb Drive Prototype at CES 2019

At CES 2019, Western Digital is demonstrating a prototype of a 4TB thumb drive with a Type-C interface. To be more precise, the form factor is that of a...

19 by Ganesh T S on 1/8/2019

Intel Veteran Becomes Chairman of Toshiba Memory

Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...

3 by Anton Shilov on 10/11/2018

Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center

Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...

6 by Anton Shilov on 9/20/2018

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