Memory
When Micron announced plans to build two new fabs in the U.S. in 2022, the company vaguely said both would come online by the decade's end. Then, in 2023, it began to optimize its spending, which pushed production at these fabrication facilities. This week, the company outlined more precise timeframes for when its fabs in Idaho and New York will start operations: this will happen from calendar 2026 to calendar 2029. "These fab construction investments are necessary to support supply growth for the latter half of this decade," a statement by Micron in its Q3 FY2024 financial results report reads. "This Idaho fab will not contribute to meaningful bit supply until fiscal 2027 and the New York construction capex is not expected to contribute to...
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
G.Skill Unveils 64 GB DDR4-4266 and 128 GB DDR4-4000 Kits for HEDTs
Coinciding with today’s launch of Intel’s HEDT “Skylake-X/Basin Falls Refresh” family of CPUs, G.Skill today announced its new 64 GB DDR4-4266 and 128 GB DDR4-4000 kits designed for high-end...
1 by Anton Shilov on 11/13/2018
In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK
One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...
19 by Ian Cutress on 11/9/2018
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips
Micron this week announced that it had started mass production of its first LPDDR4X memory devices using its second-generation 10 nm-class process technology. The new memory devices offer standard...
10 by Anton Shilov on 11/8/2018
U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm
The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...
58 by Anton Shilov on 11/1/2018
Silicon Power Enters Market of Enthusiast-Class DRAM with DDR4-4133
Silicon Power currently offers a broad range of products that span from memory cards to SSDs and from power banks to headphones. For several years the company has been...
9 by Anton Shilov on 10/23/2018
Intel's Response: Micron’s Control of 3D XPoint Fab Will Not Disrupt Optane Roadmap
Intel late on Friday said that Micron’s intention to gain full control of the IMFT joint venture will not interrupt its plans concerning products based on 3D XPoint memory...
26 by Anton Shilov on 10/22/2018
Samsung Shows Off 256 GB DDR4 RDIMM: Coming to Servers Soon
Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier...
18 by Anton Shilov on 10/19/2018
What Next for 3D XPoint? Micron to Buy Intel's Share in 3D XPoint Fab
Micron on Thursday announced plans to acquire Intel’s stake in IM Flash Technologies, a joint venture between the two companies. IM Flash owns a fab near Lehi, Utah, which...
34 by Anton Shilov on 10/18/2018
Cadence & Micron DDR5 Update: 16 Gb Chips on Track for 2019
Earlier this year Cadence and Micron performed the industry’s first public demonstration of next-generation DDR5 memory. At a TSMC event earlier this month the two companies provided some updates...
18 by Anton Shilov on 10/17/2018
Intel to Support 128GB of DDR4 on Core 9th Gen Desktop Processors
One of today’s announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up...
24 by Ian Cutress on 10/15/2018
G.Skill Announces DDR4-4800 and DDR4-4500 Kits for Z390 Boards
Every major CPU platform announcement brings a host of new motherboards and faster memory modules to the market. The launch of Intel’s 9th Gen Core processors and Z390 chipset...
30 by Anton Shilov on 10/12/2018
Intel Veteran Becomes Chairman of Toshiba Memory
Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...
3 by Anton Shilov on 10/11/2018
G.Skill Unveils 32 GB Trident Z RGB DC DDR4: Double Height, Double Capacity Memory
G.Skill has announced its new 32 GB “Double Capacity” memory modules. The Trident Z RGB DC DIMMs are compatible only with select Z390 motherboards from ASUS, and while they...
7 by Anton Shilov on 10/11/2018
Colorful Enters DRAM Module Business: Generic Colorfire & Custom iGame DIMMs
Colorful has introduced its first memory modules, officially adding a new product category that will complement its graphics cards, motherboards, and SSDs. The initial lineup consists of generic DIMMs...
4 by Anton Shilov on 10/1/2018
Double Height, Double Capacity DDR4? ZADAK's New 32 GB UDIMMs
ZADAK, a maker of memory modules from Taiwan, has reportedly published photos of its upcoming unbuffered memory modules featuring a 32 GB capacity. The UDIMMs and SO-DIMMs are the...
22 by Anton Shilov on 9/28/2018
Team Group's Quick Memory: T-Force Xtreem DDR4-4300 / DDR4-4500 CL18
Team Group has introduced its new dual-channel DDR4 memory kits for overclockers - the new T-Force Xtreem kits operate at 4300 MT/s and 4500 MT/s data transfer rates. Team Group’s...
13 by Anton Shilov on 9/20/2018
Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center
Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...
6 by Anton Shilov on 9/20/2018
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