Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S. Carrying a price tag of around 2 billion dollars, the plant in Arizona will primarily serve to package chips produced by TSMC at its Fab 21 nearby. Adding an interesting (and unusual) wrinkle to the announcement, the notoriously tight-lipped Apple also issued its own press release, officially confirming that it is set to become the largest customer of the facility. All of which has greatly raised the profile of the chip packaging plant. Huge Packaging Facility The planned facility will reside in a huge manufacturing campus covering 55 acres near Peoria, Arizona. Amkor does not disclose planned production...
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