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  • prime2515103 - Friday, May 19, 2017 - link

    Western Digital is like a scared little kid that won't leave the school because they're afraid of getting beat up by Samsung. Where is WD's high-end consumer nvme SSD?
  • Gasaraki88 - Friday, May 19, 2017 - link

    They don't have a good controller.
  • HomeworldFound - Friday, May 19, 2017 - link

    They can't do much until they take over (buy out) more of the market and start fixing prices, that and dragging their heels on increased capacity.
  • prime2515103 - Friday, May 19, 2017 - link

    Well I hope they hurry up...
  • edcoolio - Saturday, May 20, 2017 - link

    They have a good, but not great, controller.

    They need to take a company into the fold that can design great controllers. WD can fab them all day if the design is up to par.

    In the meantime, they need to keep targeting the low to mid-range consumer market. No choice.
  • Samus - Saturday, May 20, 2017 - link

    I don't understand what happened to the indilinx engineering team behind Barefoot 3 at OCZ. That was one of the most attractive components of that acquisition, imho. After all, who wants the OCZ name?
  • DanNeely - Saturday, May 20, 2017 - link

    IIRC part of why Indilinx was an attractive acquisition target at the time was that they were having trouble bringing a new competitive controller to market. I'd guess they've been unable to catch up since acquisition.
  • jjj - Friday, May 19, 2017 - link

    What's your source for the string stacking claim?
  • jjj - Friday, May 19, 2017 - link

    This press release seems to indicate otherwise, as they brag about high aspect ratio:

    "IRVINE, Calif., Jul 26, 2016 (BUSINESS WIRE) -- Western Digital Corp. today announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year. Western Digital expects meaningful commercial volumes of BiCS3 in the first half of calendar 2017.
    BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. ""

    MIcron and Intel are suspected to be using string stacking( and not confirmed AFAIK) but WD/Tosh, that's a new one.
  • Anymoore - Wednesday, May 24, 2017 - link

    There is a picture of their BICS3 here: http://www.computerworld.com/article/3166187/data-...

    The bottom part strongly suggest string stacking as the source line (the tall yellow shaft) is not connected to any of the memory pillars at the bottom. They probably extend down to the bottom of the next lower string.

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