G.Skill has now rolled out its 32 GB unbuffered DDR4 modules in dual-channel and quad-channel memory kits. The modules are offered with data transfer rates from 2666 MT/s to 4000 MT/s and various modules are compatible with AMD’s Ryzen 3000/X570 as well as Intel’s X299/Z390 platforms.

Based on pre-binned 16 Gb memory chips and proprietary PCBs, G.Skill’s hardware boils down to sets of 32 GB DDR4 unbuffered DIMMs. Lower-end modules are set to be available as single pieces as they can be used by PC makers that need to lower their BOM cost, whereas higher-end parts will be offered as dual-channel and quad-channel kits for high-end desktops and workstations. The UDIMMs feature an XMP 2.0 SPD for setting speeds beyond JEDEC.

G.Skill's 32 GB Trident Z UDIMMs and Kits
Speed CL Timing Voltage Kit
DDR4-2666 CL18 18-18-43 1.2 V 1×32 GB 32 GB
2×32 GB 64 GB
3×32 GB 128 GB
4×32 GB 256 GB
CL19 19-19-43 1×32 GB 32 GB
2×32 GB 64 GB
4×32 GB 128 GB
8×32 GB 256 GB
DDR4-3200 CL16 18-18-38 1.35 V 1×32 GB 32 GB
2×32 GB 64 GB
4×32 GB 128 GB
8×32 GB 256 GB
DDR4-3600 CL18 25-25-45 1.4 V 2×32 GB 32 GB
4×32 GB 64 GB
DDR4-3800 CL18 22-22-42 1.35 V 2×32 GB 64 GB
DDR4-4000 CL18 25-25-45 1.4 V 4×32 GB 128 GB

As there are several platforms used by enthusiasts today, G.Skill will offer two families of products:

  • Trident Z Neo for AMD Ryzen 3000/X570 platforms
  • rident Z Royal for Intel platforms.

For AMD Ryzen 3000-based PCs, the highest-performing kits will be 64 GB DDR4-3800 CL18 as well as 128 GB DDR4-3600 CL18 offerings. For the Intel platform, the highest end kits will be 128 GB DDR4-4000 CL18 as well as 256 GB DDR4-3200 CL16. Validation for AMD is done using the MSI MEG X570 Godlike motherboard, whereas validation for Intel is made on the ASUS ROG Rampage VI Extreme Encore motherboard. Other motherboards will be validated over time, and likely up to the motherboard manufacturers in their own QVL.

All enthusiast-class 32 GB unbuffered DIMMs from G.Skill will be equipped with aluminum heat spreaders with an RGB lightbar with multiple lighting zones. The Trident Z Royal will come with polished silver or gold heat spreaders as well as a crystalline RGB lightbar, whereas the Trident Z Neo will use matte heat spreaders and an RGB lightbar.

One thing to keep in mind about 32 GB UDIMMs is that they may require a BIOS update as not all motherboards support them out-of-box.

G.Skill will start sales of its 32 GB UDIMMs as well as dual-channel and quad-channel kits that use them later this quarter. Pricing will depend on capacity as well as rated performance levels, but since these products are designed for high-end PCs, they will be priced accordingly.


Related Reading

Source: G.Skill

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  • PeachNCream - Thursday, October 10, 2019 - link

    Why would they fix it? It's you and the rest of us that are wrong. We obviously don't math as well as whomever copy-pasted this table together.
  • regsEx - Wednesday, October 9, 2019 - link

    Unlikely Samsung B-die or A-die. May be M-die? Or Hynix CJR?
  • extide - Wednesday, October 9, 2019 - link

    Probably Micron something (like the corsair sticks that have been out a few weeks) or possibly Samsung M-die. I haven't heard of Hynix 16gb yet but who knows..?
  • regsEx - Wednesday, October 9, 2019 - link

    Well, you may be right, considering 1.4 V for 3600 could be Micron E-die.
  • drgatsby - Thursday, October 10, 2019 - link

    What about 256GB on a TR4 motherboard?
  • Soulkeeper - Thursday, October 10, 2019 - link

    Those voltages are a bit high.
    1.35v to do 3200 ... not really impressed
  • evernessince - Thursday, October 10, 2019 - link

    Given that a vast majority of DDR4 3200 sticks use 1.35v, it's mostly irrelevant. These sticks are mostly about capacity, not low voltage. You'll save a tiny fraction of a watt by getting a 1.2v kit. 1.35v is far from where you can push DDR4 as well. These sticks are fine up to 1.45v.

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